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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Multi-function and shielded 3d interconnects. Tessera Research, March 22, 2012: US20120068327-A1


A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening ext ...


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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Staged via formation from both sides of chip. Tessera Research, March 22, 2012: US20120068330-A1


A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respect ...


3
James Kraemer Ph.D.
Robert R Friedlander, James R Kraemer: User accessibility to data analytics. International Business Machines Corporation, March 22, 2012: US20120072460-A1


A computer implemented method, system, and/or computer program product performs an appropriate type of data analysis for a user. A preliminary request for a data analysis is received from a user having a user profile. The preliminary request fails to identify an appropriate data source for the data ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ellis Chau, Wael Zohni, Philip Damberg, Richard Dewitt Crisp: Impedance controlled packages with metal sheet or 2-layer rdl. Tessera Research, March 22, 2012: US20120068338-A1


A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Brian Marcucci: Tsop with impedance control. Tessera Research, March 22, 2012: US20120068317-A1


A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial portion of one conductive element ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ellis Chau, Wael Zohni, Richard Dewitt Crisp: Metal can impedance control structure. Tessera Research, March 22, 2012: US20120068365-A1


A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive el ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Stacked multi-die packages with impedance control. Tessera Research, March 22, 2012: US20120068361-A1


A microelectronic assembly may include microelectronic devices arranged in a stack and having device contacts exposed at respective front surfaces. Signal conductors having substantial portions extending above the front surface of the respective microelectronic devices connect the device contacts wi ...


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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Chip assembly having via interconnects joined by plating. Tessera Research, March 22, 2012: US20120068351-A1


An assembly and method of making same are provided. The assembly can be formed by juxtaposing a first electrically conductive element overlying a major surface of a first semiconductor element with an electrically conductive pad exposed at a front surface of a second semiconductor element. An openin ...


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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia: Stacked chip assembly having vertical vias. Tessera Research, March 22, 2012: US20120068352-A1


An assembly and method of making same are provided. The assembly can be formed by stacking a first semiconductor element atop a second semiconductor element and forming an electrically conductive element extending through openings of the semiconductor elements. The openings may be staged. The conduc ...


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