1
Ravi Jallepally, Shih Hung Li, Alain Duboust, Jun Zhao, Liang Yuh Chen, Daniel A Carl: Apparatus and method for fast-cycle atomic layer deposition. Applied Materials, Moser Patterson & Sheridan, August 10, 2004: US06773507 (92 worldwide citation)


Method and apparatus for depositing layers by atomic layer deposition. A virtual shower curtain is established between the substrate support and chamber to minimize the volume in which the reactants are distributed. A showerhead may be used to allow closer placement of the substrate thereto, further ...


2
Alain Duboust, Shou Sung Chang, Liang Yuh Chen, Yan Wang, Siew Neo, Lizhong Sun, Feng Q Liu: Method and apparatus for face-up substrate polishing. Applied Materials, Moser Patterson & Sheridan, August 17, 2004: US06776693 (51 worldwide citation)


A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a basin and a polishing head. A carrier is disposed in the basin and has a substrate supporting surface. A retaining ring is disposed on the carrier and at least part ...


3
Liang Yuh Chen, Wei Yung Hsu, Alain Duboust, Ratson Morad, Daniel A Carl: Planarization of substrates using electrochemical mechanical polishing. Applied Materials, Moser Patterson & Sheridan, November 2, 2004: US06811680 (43 worldwide citation)


A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substra ...


4
Alain Duboust, Lizhong Sun, Feng Q Liu, Yuchun Wang, Yan Wang, Siew Neo, Liang Yuh Chen: Electrolyte composition and treatment for electrolytic chemical mechanical polishing. Applied Materials, Moser Patterson & Sheridan, May 31, 2005: US06899804 (37 worldwide citation)


An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The composition has a pH between about 3 a ...


5
Paul D Butterfield, Liang Yuh Chen, Yonqi Hu, Antoine P Manens, Rashid Mavliev, Stan D Tsai, Feng Q Liu, Ralph Wadensweiler, Lizhong Sun, Siew S Neo, Alain Duboust: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Moser Patterson & Sheridan, November 8, 2005: US06962524 (37 worldwide citation)


Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. ...


6
Liang Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A Carl, Ralph Wadensweiler, Manoocher Birang, Paul D Butterfield, Rashid Mavliev, Stan D Tsai: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Patterson & Sheridan, January 24, 2006: US06988942 (23 worldwide citation)


An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a ...


7
Yongqi Hu, Yan Wang, Alain Duboust, Feng Q Liu, Rashid Mavliev, Liang Yuh Chen, Ratson Morad, Sasson Somekh: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Patterson & Sheridan, December 27, 2005: US06979248 (22 worldwide citation)


An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, con ...


8
Liang Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A Carl, Ralph Wadensweiler, Manoocher Birang, Paul D Butterfield, Rashid Mavliev, Stan D Tsai: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Patterson & Sheridan, June 27, 2006: US07066800 (20 worldwide citation)


An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a ...


9
Yan Wang, Feng Q Liu, Alain Duboust, Siew S Neo, Liang Yuh Chen, Yongqi Hu: Hydrogen bubble reduction on the cathode using double-cell designs. Applied Materials, Patterson & Sheridan, June 12, 2007: US07229535 (15 worldwide citation)


An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing system that reduces the number of def ...


10
Paul D Butterfield, Liang Yuh Chen, Yonqi Hu, Antoine P Manens, Rashid Mavliev, Stan D Tsai, Feng Q Liu, Ralph Wadensweiler, Lizhong Sun, Siew S Neo, Alain Duboust: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Patterson & Sheridan, September 9, 2008: US07422516 (14 worldwide citation)


Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular uppe ...



Click the thumbnails below to visualize the patent trend.