1
Ravi Jallepally, Shih Hung Li, Alain Duboust, Jun Zhao, Liang Yuh Chen, Daniel A Carl: Apparatus and method for fast-cycle atomic layer deposition. Applied Materials, Moser Patterson & Sheridan, August 10, 2004: US06773507 (92 worldwide citation)


Method and apparatus for depositing layers by atomic layer deposition. A virtual shower curtain is established between the substrate support and chamber to minimize the volume in which the reactants are distributed. A showerhead may be used to allow closer placement of the substrate thereto, further ...


2
Alain Duboust, Shou Sung Chang, Liang Yuh Chen, Yan Wang, Siew Neo, Lizhong Sun, Feng Q Liu: Method and apparatus for face-up substrate polishing. Applied Materials, Moser Patterson & Sheridan, August 17, 2004: US06776693 (51 worldwide citation)


A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a basin and a polishing head. A carrier is disposed in the basin and has a substrate supporting surface. A retaining ring is disposed on the carrier and at least part ...


3
Liang Yuh Chen, Wei Yung Hsu, Alain Duboust, Ratson Morad, Daniel A Carl: Planarization of substrates using electrochemical mechanical polishing. Applied Materials, Moser Patterson & Sheridan, November 2, 2004: US06811680 (43 worldwide citation)


A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substra ...


4
Alain Duboust, Lizhong Sun, Feng Q Liu, Yuchun Wang, Yan Wang, Siew Neo, Liang Yuh Chen: Electrolyte composition and treatment for electrolytic chemical mechanical polishing. Applied Materials, Moser Patterson & Sheridan, May 31, 2005: US06899804 (37 worldwide citation)


An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The composition has a pH between about 3 a ...


5
Paul D Butterfield, Liang Yuh Chen, Yonqi Hu, Antoine P Manens, Rashid Mavliev, Stan D Tsai, Feng Q Liu, Ralph Wadensweiler, Lizhong Sun, Siew S Neo, Alain Duboust: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Moser Patterson & Sheridan, November 8, 2005: US06962524 (35 worldwide citation)


Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. ...


6
Liang Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A Carl, Ralph Wadensweiler, Manoocher Birang, Paul D Butterfield, Rashid Mavliev, Stan D Tsai: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Patterson & Sheridan, January 24, 2006: US06988942 (23 worldwide citation)


An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a ...


7
Yongqi Hu, Yan Wang, Alain Duboust, Feng Q Liu, Rashid Mavliev, Liang Yuh Chen, Ratson Morad, Sasson Somekh: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Patterson & Sheridan, December 27, 2005: US06979248 (22 worldwide citation)


An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, con ...


8
Liang Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A Carl, Ralph Wadensweiler, Manoocher Birang, Paul D Butterfield, Rashid Mavliev, Stan D Tsai: Conductive polishing article for electrochemical mechanical polishing. Applied Materials, Patterson & Sheridan, June 27, 2006: US07066800 (20 worldwide citation)


An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a ...


9
Yan Wang, Feng Q Liu, Alain Duboust, Siew S Neo, Liang Yuh Chen, Yongqi Hu: Hydrogen bubble reduction on the cathode using double-cell designs. Applied Materials, Patterson & Sheridan, June 12, 2007: US07229535 (15 worldwide citation)


An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing system that reduces the number of def ...


10
Shou Sung Chang, Stan D Tsai, Donald J K Olgado, Liang Yuh Chen, Alain Duboust, Ralph M Wadensweiler: Pad assembly for electrochemical mechanical processing. Applied Materials, Patterson & Sheridan, April 18, 2006: US07029365 (13 worldwide citation)


Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the l ...



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