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Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Flexible lead structures and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 12, 2000: US06117694 (109 worldwide citation)


A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporar ...


2
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Flexible lead structures and methods of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 7, 2004: US06828668 (89 worldwide citation)


An interconnect component comprises a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through the compliant layer. The first ends extend generally parallel to said first surface.


3
Belgacem Haba Belgacem (Bel) Haba
Joseph Fjelstad, Masud Beroz, John W Smith, Belgacem Haba: Microelectric packages having deformed bonded leads and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 1, 2005: US06848173 (40 worldwide citation)


A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on th ...


4
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Multi-layer substrates and fabrication processes. Tessera, Lerner David Littenberg Krumholz & Mentlik, August 6, 2002: US06429112 (35 worldwide citation)


Multilayer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high density vertical interconnection, and c ...


5
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Multi-layer substrates and fabrication processes. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 15, 2005: US06965158 (31 worldwide citation)


Multi-layer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high density vertical interconnection, and ...


6
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Semiconductor chip package with interconnect structure. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 16, 2003: US06664621 (8 worldwide citation)


An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous cl ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, John W Smith: Vapor phase connection techniques. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 13, 2004: US06675469 (7 worldwide citation)


Electrical connections are made between a pair of elements disposed on opposite side of the hole extending through a dielectric layer by evaporating a conductive material such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The pr ...


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Belgacem Haba Belgacem (Bel) Haba
Thomas H DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W Smith: Connection component with peelable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 27, 2006: US07067742 (5 worldwide citation)


A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support struc ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, John W Smith: Method for creating a die shrink insensitive semiconductor package and component therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, October 9, 2001: US06300231 (5 worldwide citation)


A method of connecting a substrate to a semiconductor chip and component therefor to allow for the packaging of a chip even after successive die shrinks. The method compensates for successive die shrinks by providing a substrate that has connection sections of electrical leads that are releasable an ...


10
Belgacem Haba Belgacem (Bel) Haba
Thomas H DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light, John W Smith: Method of making connection component. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 19, 2002: US06357112 (4 worldwide citation)


A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. ...



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