1
Katsuyuki Musaka
Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka: Plating apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, March 8, 2011: US07901550 (2 worldwide citation)


A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves a ...


2
Katsuyuki Musaka
Natsuki Makino, Junji Kunisawa, Keisuke Namiki, Yukio Fukunaga, Katsuyuki Musaka, Ray Fang, Emanuel Israel Cooper, John Michael Cotte, Hariklia Deligianni, Keith T Kwietniak, Brett C Baker O Neal, Matteo Flotta, Philippe Mark Vereecken: Electrolytic processing apparatus and method. Squire Sanders & Dempsey, February 15, 2007: US20070034526-A1


An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface ...


3
Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura, Hiroaki Inoue, Norio Kimura, Tetsuo Matsuda, Hisashi Kaneko, Nobuo Hayasaka, Katsuya Okumura, Manabu Tsujimura, Toshiyuki Morita: Plating apparatus. Ebara Corporation, Kabushiki Kaisha Toshiba, Wenderoth Lind & Ponack L, October 14, 2003: US06632335 (53 worldwide citation)


A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion


4
Junji Kunisawa, Norio Kimura: Polishing apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, May 6, 2003: US06558239 (20 worldwide citation)


A polishing apparatus has a feed reel for feeding a polishing tape wound thereon and having a polishing surface, a take-up reel for reeling up the polishing tape from the feed reel, a presser for pressing the polishing tape between the feed reel and the take-up reel against a surface, to be polished ...


5
Koji Mishima, Junji Kunisawa, Natsuki Makino, Norio Kimura, Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Takahiro Nanjo, Mitsuko Odagaki: Substrate processing apparatus and substrate plating apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, February 10, 2004: US06689257 (20 worldwide citation)


A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded ...


6
Junji Kunisawa, Norio Kimura, Kenya Ito, Akira Fukunaga, Yuuki Inoue, Hiroshi Tomita, Soichi Nadahara, Motoyuki Sato: Holding unit, processing apparatus and holding method of substrates. Ebara Corporation, Wenderoth Lind & Ponack L, June 6, 2006: US07055535 (17 worldwide citation)


A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a b ...


7
Satoru Yamamoto, Keiichi Kurashina, Takashi Kawakami, Tsutomu Nakada, Hiroyuki Kanda, Junji Kunisawa, Kunihito Ide: Electroplating apparatus and electroplating method. Ebara Corporation, Wenderoth Lind & Ponack L, October 4, 2011: US08029653 (8 worldwide citation)


An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder ...


8
Norio Kimura, Mitsuhiko Shirakashi, Katsuya Okumura, You Ishii, Junji Kunisawa, Hiroyuki Yano: Polishing apparatus and method. Ebara Corporation, Kabushiki Kaisha Toshiba, Wenderoth Lind & Ponack L, September 19, 2006: US07108589 (6 worldwide citation)


A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The p ...


9
Norio Kimura, Mitsuhiko Shirakashi, Katsuya Okumura, You Ishii, Junji Kunisawa, Hiroyuki Yano: Polishing apparatus and method. Ebara Corporation, Kabushiki Kaisha Toshiba, Wenderoth Lind & Ponack L, April 20, 2004: US06722964 (6 worldwide citation)


A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The p ...


10
Koji Mishima, Hiroaki Inoue, Natsuki Makino, Junji Kunisawa, Kenji Nakamura, Tetsuo Matsuda, Hisashi Kaneko, Toshiyuki Morita: Plating method and plating apparatus. Ebara Corporation, Kabushiki Kaisha Toshiba, Wenderoth Lind & Ponack L, June 8, 2004: US06746589 (5 worldwide citation)


The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with use of a plating liquid having high throwing power and leveling properties, and which can make film thickness of a plated film substantially equal be ...



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