1
Katsuyuki Musaka
Katsuyuki Musaka, Shinzuke Mizuno: Method of forming a thin film for a semiconductor device. Applied Materials, Birgit E Morris, Michael B Einschlag, November 5, 1996: US05571571 (32 worldwide citation)


A method of forming conformal, high quality silicon oxide films that can be deposited over closely spaced, submicron lines and spaces without the formation of voids, comprises forming a plasma of TEOS and a selected halogen-containing gas in certain ratios. By proper control of the energy sources th ...


2
Katsuyuki Musaka
Katsuyuki Musaka: Method of forming a thin film for a semiconductor device. Applied Materials, Birgit Morris, August 19, 2003: US06607790 (3 worldwide citation)


The present invention relates to a plasma-enhanced chemical vapor deposition (PECVD) method of depositing a thin layer of a material, such as silicon dioxide, on the surface of a body, such as a semiconductor substrate. The method includes forming in a deposition chamber a plasma by means of two ele ...


3
Katsuyuki Musaka
Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka: Plating apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, March 8, 2011: US07901550 (2 worldwide citation)


A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves a ...


4
Katsuyuki Musaka
Masayuki Kumekawa, Norio Kimura, Yukio Fukunaga, Katsuyuki Musaka: Electrolytic processing apparatus. Squire Sanders & Dempsey, February 15, 2007: US20070034502-A1


An electrolytic processing apparatus is used to remove a metal film formed on a surface of a substrate. The electrolytic processing apparatus includes a feeding electrode 31 for feeding electricity to a metal film 6 on a substrate W, a processing electrode 32 for processing the metal film 6, a subst ...


5
Katsuyuki Musaka
Natsuki Makino, Junji Kunisawa, Keisuke Namiki, Yukio Fukunaga, Katsuyuki Musaka, Ray Fang, Emanuel Israel Cooper, John Michael Cotte, Hariklia Deligianni, Keith T Kwietniak, Brett C Baker O Neal, Matteo Flotta, Philippe Mark Vereecken: Electrolytic processing apparatus and method. Squire Sanders & Dempsey, February 15, 2007: US20070034526-A1


An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface ...


6
Katsuyuki Musaka
Masayuki Kumekawa, Norio Kimura, Yukio Fukunaga, Katsuyuki Musaka, Hariklia Deligianni, Emanuel Israel Cooper, Philippe Mark Vereecken: Electrolytic processing method. Squire Sanders & Dempsey, February 15, 2007: US20070034525-A1


An electrolytic processing method is used to remove a metal film formed on a surface of a substrate. The electrolytic processing method includes providing a feeding electrode 31 and a processing electrode 32 on a table 12, providing an insulating member 36 between the feeding electrode and the proce ...


7
Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka: Plating apparatus. Wenderoth Lind & Ponack, April 16, 2009: US20090095618-A1


A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus included a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves a ...


8
Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka, Philippe Vereecken, Brett C Baker O Neal, Hariklia Deligianni, Keith Kwietniak: Plating method. Wenderoth Lind & Ponack, April 16, 2009: US20090095634-A1


A plating method can form a plated film having a uniform thickness over the entire surface, including the peripheral surface, of a substrate. The plating method includes: disposing an anode so as to face a conductive film, formed on a substrate, which serves as a cathode, and disposing an auxiliary ...



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