1
Katsuyuki Musaka
Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka: Plating apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, March 8, 2011: US07901550 (2 worldwide citation)


A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves a ...


2
Katsuyuki Musaka
Natsuki Makino, Junji Kunisawa, Keisuke Namiki, Yukio Fukunaga, Katsuyuki Musaka, Ray Fang, Emanuel Israel Cooper, John Michael Cotte, Hariklia Deligianni, Keith T Kwietniak, Brett C Baker O Neal, Matteo Flotta, Philippe Mark Vereecken: Electrolytic processing apparatus and method. Squire Sanders & Dempsey, February 15, 2007: US20070034526-A1


An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface ...


3
Norio Kimura, Takayoshi Kawamoto, You Ishii, Katsuyuki Aoki, Kunio Tateishi, Hozumi Yasuda, Keisuke Namiki: Method and apparatus for polishing workpiece. Ebara Corporation, Wenderoth Lind & Ponack, July 29, 1997: US05651724 (44 worldwide citation)


A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ...


4
Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi: Substrate holding apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, February 8, 2005: US06852019 (20 worldwide citation)


The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the subs ...


5
Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida: Substrate holding apparatus and substrate polishing apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, May 10, 2005: US06890402 (10 worldwide citation)


A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periph ...


6
Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi: Substrate holding apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, August 1, 2006: US07083507 (6 worldwide citation)


The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the subs ...


7
Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi: Substrate holding apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, February 17, 2009: US07491117 (5 worldwide citation)


The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the el ...


8
Hozumi Yasuda, Katsuhide Watanabe, Keisuke Namiki, Osamu Nabeya, Makoto Fukushima, Satoru Yamaki, Shingo Togashi: Elastic membrane. Ebara Corporation, Wenderoth Lind & Ponack L, October 14, 2014: US08859070 (3 worldwide citation)


An elastic member for use in a substrate holding apparatus includes an elastic member and a first reinforcing member. The first reinforcing member has a higher rigidity than the elastic membrane and reinforces substantially an entire area of the contact portion of the elastic membrane. The contact p ...


9
Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi: Substrate polishing machine. Ebara Corporation, Westerman Hattori Daniels & Adrian, January 2, 2007: US07156725 (2 worldwide citation)


There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surfa ...


10
Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida: Substrate holding apparatus and substrate polishing apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, March 1, 2011: US07897007 (1 worldwide citation)


A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of t ...



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