1
Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Ryoichi Kimizuka, Hariklia Deligianni, Brett Baker, Keith Kwietniak, Panayotis Andricacos, Phillipe Vereecken: Plating apparatus and plating method. Ebara Corporation, International Business Machines Corporation, Wenderoth Lind & Ponack L, June 30, 2009: US07553400 (2 worldwide citation)


A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect re ...


2
Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Hidenao Suzuki, Koji Mishima, Brett C Baker O Neal, Hariklia Deligianni, Keith Kwietniak: Plating method and plating apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, January 20, 2009: US07479213 (1 worldwide citation)


A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenc ...


3
Keiichi Kurashina, Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima, Brett Baker, Keith Kwietniak, Hariklia Deligianni, Panos Andricacos: Plating apparatus and plating method. Wenderoth Lind & Ponack, March 24, 2005: US20050061659-A1


A plating apparatus is used for filling a fine interconnect pattern formed in a substrate with metal to form interconnects. The plating apparatus includes a cathode unit having a seal member for hermetically sealing a peripheral portion of a surface, to be plated, of the substrate and a cathode elec ...


4
Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Ryoichi Kimizuka, Hariklia Deligianni, Brett Baker, Keith Kwietniak, Panayotis Andricacos, Philippe Vereecken: Plating apparatus and plating method. Wenderoth Lind & Ponack, November 3, 2005: US20050241946-A1


A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect re ...


5
Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka, Philippe Vereecken, Brett C Baker O Neal, Hariklia Deligianni, Keith Kwietniak: Plating method. Wenderoth Lind & Ponack, April 16, 2009: US20090095634-A1


A plating method can form a plated film having a uniform thickness over the entire surface, including the peripheral surface, of a substrate. The plating method includes: disposing an anode so as to face a conductive film, formed on a substrate, which serves as a cathode, and disposing an auxiliary ...



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