1
Katsuyuki Musaka
Natsuki Makino, Junji Kunisawa, Keisuke Namiki, Yukio Fukunaga, Katsuyuki Musaka, Ray Fang, Emanuel Israel Cooper, John Michael Cotte, Hariklia Deligianni, Keith T Kwietniak, Brett C Baker O Neal, Matteo Flotta, Philippe Mark Vereecken: Electrolytic processing apparatus and method. Squire Sanders & Dempsey, February 15, 2007: US20070034526-A1


An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface ...


2
Panayotis C Andricacos, Kirk G Berridge, John O Dukovic, Matteo Flotta, Jose Ordonez, Helmut R Poweleit, Jeffrey S Richter, Lubomyr T Romankiw, Otto P Schick, Frank Spera, Kwong Hon Wong: Vertical paddle plating cell. International Business Machines Corporation, Stephen S Strunck, Francis L Conte, May 14, 1996: US05516412 (161 worldwide citation)


An electroplating cell includes a floor, ceiling, front wall, and back wall forming a box having first and second opposite open ends. A rack for supporting an article to be electroplated is removably positioned vertically to close the first open end and includes a thief laterally surrounding the art ...


3
Panayotis Andricacos, Moritz Branger, Robert M Browne, John O Dukovic, Benjamin W B Fu, Robert W Hitzfeld, Matteo Flotta, Donald R McKenna, Lubomyr T Romankiw, Saeed Sahami: Multi-compartment eletroplating system. International Business Machines Corporation, Ratner & Prestia, May 17, 1994: US05312532 (67 worldwide citation)


A multi-compartment electroplating system for electroplating two or more objects simultaneously such that the electrodeposited material is substantially uniform in thickness and composition. Electroplating solution is circulated between a reservoir and a multi-compartment tank which has one cathode- ...


4
John M Cotte, Matteo Flotta, Kenneth J McCullough, Wayne M Moreau, Keith R Pope, John P Simons, Charles J Taft: Turbine part mount for supercritical fluid processor. International Business Machines Corporation, Daniel P Morris, Perman & Green, May 18, 2004: US06736906 (9 worldwide citation)


A workpiece holder for processing a workpiece in a chamber of a liquified fluid. In one embodiment, the workpiece holder includes a cylindrically shaped rotator having an exterior wall and at least one fluid guide on the exterior wall. The rotator is adapted to rotate and provide fluid flow across a ...


5
Gareth Hougham, Leena Paivikki Buchwalter, Stephen L Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey D Gelorme, Kathleen C Hinge, Anurag Jain, Sung K Kang, John U Knickerbocker: Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation. International Business Machines Corporation, Connolly Bove Lodge & Hutz, Daniel P Morris Esq, November 18, 2008: US07452568 (4 worldwide citation)


The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or p ...


6
John Michael Cotte, Matteo Flotta, Kenneth John McCullough, Wayne Martin Moreau, John P Simons, Charles J Taft: Fixtures for processing a workpiece in a supercritical fluid. International Business Machines Corporation, Daniel P Norris Esq, Scully Scott Murphy & Presser, June 17, 2003: US06579464 (2 worldwide citation)


Fixtures and methods for clamping workpieces in a workplace to enable the optimized exposure thereof to a stream or flow of a supercritical fluid. Provided is a rotatably indexable chuck or locator mounting the workpiece and enabling orientating the latter in specific static pitch position within a ...


7
Gareth Hougham, Leena Paivikki Buchwalter, Stephen L Buchwalter, Jon Casey, Claudius Feger, Matteo Flotta, Jeffrey D Gelmore, Kathleen C Hinge, Anurag Jain, Sung K Kang, John U Knickerbocker: Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation. International Business Machines Corporation, Connolly Bove Lodge & Hutz, Daniel P Morris, October 19, 2010: US07815968 (1 worldwide citation)


The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or p ...


8
Veeraraghavan S Basker, John M Cotte, Hariklia Deligianni, Matteo Flotta: Apparatus and method for electrochemical processing of thin films on resistive substrates. International Business Machines Corporation, Connolly Bove Lodge & Hutz, Daniel P Morris Esq, November 6, 2012: US08303791


An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; provi ...


9
Matteo Flotta, Lubomyr Taras Romankiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb: Enhanced magnetic plating method. International Business Machines Corporation, Michael J Buchenhorner, Vazken Alexanian, June 21, 2011: US07964081


An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank ...


10
Matteo Flotta, Lubomyr T Romanikiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb: Apparatus for an enhanced magnetic plating method. International Business Corporation, Michael J Buchenhorner, Vazken Alexanian, May 1, 2012: US08168045


An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank ...



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