1
Jun Zhao, Tom Cho, Charles Dornfest, Stefan Wolff, Kevin Fairbairn, Xin S Guo, Alex Schreiber, John M White: CVD Processing chamber. Applied Materials, Janis Biksa, September 24, 1996: US05558717 (313 worldwide citation)


A process chamber is disclosed which provides a 360.degree. circular gas/vacuum distribution over a substrate being processed. The substrate being processed is supported on a heated and optionally cooled pedestal assembly. The substrate faces a one-piece gas distribution faceplate being connected to ...


2
Jun Zhao, Tom Cho, Charles Dornfest, Stefan Wolff, Kevin Fairbairn, Xin Sheng Guo, Alex Schreiber, John M White: CVD processing chamber. Applied Materials, Peters Verney Jones & Biksa, December 29, 1998: US05853607 (56 worldwide citation)


A process chamber is disclosed which provides a 360.degree. circular gas/vacuum distribution over a substrate being processed. The substrate being processed is supported on a heated and optionally cooled pedestal assembly. The substrate faces a one-piece gas distribution faceplate being connected to ...


3
Jun Zhao, Tom Cho, Xin Sheng Guo, Atsushi Tabata, Jianmin Qiao, Alex Schreiber: Method of reducing residue accumulation in CVD chamber using ceramic lining. Applied Materials, Townsend & Townsend & Crew, March 23, 1999: US05885356 (54 worldwide citation)


The present invention provides a method and apparatus for limiting residue build-up by lining with a ceramic material the exhaust plenun and exhaust manifold of a processing chamber. In another aspect of the invention, the inventors have used an air gap between the ceramic liner and the processing c ...


4
Tom Cho, Christopher Ngai: Exhaust baffle for uniform gas flow pattern. Applied Materials, Michael A Glenn, August 15, 1995: US05441568 (24 worldwide citation)


An arc shaped exhaust baffle having two ends that define a gap therebetween that is not directly accessible by the exhaust plenum, that provides improved process gas flow distribution in a semiconductor process chamber, has a plurality of apertures formed therethrough and distributed about a baffle ...


5
Thomas Nowak, Juan Carlos Rocha Alvarez, Andrzej Kaszuba, Scott A Hendrickson, Dustin W Ho, Sanjeev Baluja, Tom Cho, Josephine Chang, Hichem M Saad: High efficiency UV curing system. Applied Materials, Patterson & Sheridan, February 16, 2010: US07663121 (13 worldwide citation)


An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. ...


6
Michael P Karazim, Tetsuya Ishikawa, Rudolf Gujer, Thomas Kring, Pavel Staryuk, Abhi Desai, Tom Cho, Michael Douglas: Antenna coil assemblies for substrate processing chambers. Applied Materials, Townsend & Townsend & Crew, February 27, 2001: US06192829 (7 worldwide citation)


The present invention provides exemplary antenna coil assemblies and substrate processing chambers using such assemblies. In one embodiment, an antenna coil assembly (


7
Jennifer Y Sun, Biraja Kanungo, Tom Cho, Ying Zhang: Aerosol deposition coating for semiconductor chamber components. Applied Materials, Lowenstein Sandler, July 18, 2017: US09708713


A method for coating a component for use in a semiconductor chamber for plasma etching includes providing the component and loading the component in a deposition chamber. A pressure in the deposition chamber is reduced to below atmospheric pressure. A coating is deposited on the component by sprayin ...


8
Thomas Nowak, Juan Carlos Rocha Alvarez, Andrzej Kaszuba, Scott A Hendrickson, Dustin W Ho, Sanjeev Baluja, Tom Cho, Josephine Chang, Hichem M Saad: High efficiency UV curing system. Applied Materials, Patterson & Sheridan, November 9, 2006: US20060249175-A1


An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. ...


9
Thomas Nowak, Juan Carlos Rocha Alvarez, Andrzej Kaszuba, Scott A Hendrickson, Dustin W Ho, Sanjeev Baluja, Tom Cho, Josephine Chang, Hichem M Saad: High efficiency uv curing system. Patterson & Sheridan, November 9, 2006: US20060249078-A1


An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. ...


10
Thomas Nowak, Juan Carlos Rocha Alvarez, Andrzej Kaszuba, Scott A Hendrickson, Dustin W Ho, Sanjeev Baluja, Tom Cho, Josephine Chang, Hichem M Saad: Tandem uv chamber for curing dielectric materials. Applied Materials, Patterson & Sheridan, November 9, 2006: US20060251827-A1


An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. ...



Click the thumbnails below to visualize the patent trend.