1
Katsuyuki Musaka
Natsuki Makino, Junji Kunisawa, Keisuke Namiki, Yukio Fukunaga, Katsuyuki Musaka, Ray Fang, Emanuel Israel Cooper, John Michael Cotte, Hariklia Deligianni, Keith T Kwietniak, Brett C Baker O Neal, Matteo Flotta, Philippe Mark Vereecken: Electrolytic processing apparatus and method. Squire Sanders & Dempsey, February 15, 2007: US20070034526-A1


An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface ...


2
Harry F Hull, Ivan P Da Silva: Electrolytic processing apparatus and method with time multiplexed power supply. Renner Otto Boisselle & Sklar, September 17, 1991: US05049246 (10 worldwide citation)


Apparatus for electrolytic processing of materials, includes an electrolytic processing bath, plural first electrodes, at least one second electrode, and a power supply for supplying time multiplexed power to the electrodes. The power supply may include a pulse width modulator or a pulse position mo ...


3
Harry F Hull, Ivan P Da Silva: Electrolytic processing apparatus and method with time multiplexed power supply. Renner Otto Boisselle & Sklar, April 16, 1991: US05007993 (10 worldwide citation)


Computerized apparatus for electrolytic processing of materials, includes an electrolytic processing bath, plural first electrodes, at least one second electrode, and a computerized power supply for supplying time multiplexed power to the electrodes. The power supply may include a pulse width modula ...


4
Mitsuhiko Shirakashi, Masayuki Kumekawa, Hozumi Yasuda, Itsuki Kobata, Osamu Nabeya: Electrolytic processing apparatus and method. Ebara Corporation, Wenderoth Lind & Ponack L, February 2, 2010: US07655118


This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that ...


5
Kobata Itsuki, Shirakashi Mitsuhiko, Kumekawa Masayuki, Saito Takayuki, Toma Yasushi, Suzuki Tsukuru, Yamada Kaoru, Makita Yuji, Yasuda Hozumi, Noji Ikutaro, Fujiwara Kunio, Nabeya Osamu: Electrolytic processing apparatus and method. Ebara, April 11, 2007: EP1772536-A1


There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) ...


6
Natsuki Makino, Junji Kunisawa: Electrolytic processing apparatus and method. Ebara Corporation, Wenderoth Lind & Ponack L, October 28, 2008: US07442282


An electrolytic processing apparatus according to an embodiment of the present invention includes: a substrate holder for holding a substrate; a first electrode to make contact with the substrate for passing electricity to a processing surface of the substrate; an electrode head including a high res ...


7
Shirakashi Mitsuhiko, Kumekawa Masayuki, Yasuda Hozumi, Kobata Itsuki, Nabeya Osamu: Electrolytic processing apparatus and method. Ebara, October 27, 2004: EP1470269-A1


This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that ...


8
Kobata Itsuki, Shirakashi Mitsuhiko, Kumekawa Masayuki, Saito Takayuki, Toma Yasushi, Suzuki Tsukuru, Yamada Kaoru, Makita Yuji, Yasuda Hozumi, Noji Ikutaro, Fujiwara Kunio, Nabeya Osamu: Electrolytic processing apparatus and method. Ebara, June 30, 2004: EP1432852-A2


There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) ...


9
Shirakashi Mitsuhiko, Kumekawa Masayuki, Yasuda Hozumi, Kobata Itsuki: Electrolytic processing apparatus and method. Ebara, September 8, 2004: EP1453991-A1


There is provided an electrolytic processing apparatus and method that can effect processing of a workpiece with high processing precision and can produce an intended form of processed workpiece with high accuracy of form. The electrolytic processing apparatus includes: a processing electrode which ...


10
Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda, Ikutaro Noji, Kunio Fujiwara, Osamu Nabeya: Electrolytic processing apparatus and method. Wenderoth Lind & Ponack, December 23, 2004: US20040256237-A1


There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) ...



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