1
Siamak Fazel Pour: Single Paddle having a semiconductor device and a passive electronic component. Conexant Systems, Snell & Wilmer L, January 1, 2002: US06335564 (159 worldwide citation)


A semiconductor package and a corresponding method of forming this package are provided. The semiconductor package includes a paddle and a semiconductor device mounted on the paddle. A passive electronic component is also mounted on the paddle and spaced apart from the semiconductor device. Intercon ...


2
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, November 5, 2002: US06475896 (44 worldwide citation)


A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (


3
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, October 12, 2004: US06803663 (31 worldwide citation)


An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (


4
Nobuaki Hashimoto: Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board. Seiko Epson Corporation, Oliff & Berridge, February 4, 2003: US06515370 (24 worldwide citation)


An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (


5
Michael Bauer, Peter Strobel, Gerald Ofner, Edward F├╝rgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig Czaja PLLC, September 2, 2008: US07420262 (20 worldwide citation)


The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...


6
Nobuaki Hashimoto: Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board. Seiko Epson Corporation, Oliff & Berridge, January 24, 2006: US06989605 (13 worldwide citation)


An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


7
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, May 4, 2004: US06730589 (12 worldwide citation)


A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (


8
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, December 30, 2008: US07470979 (7 worldwide citation)


A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


9
Nobuaki Hashimoto: Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument. Seiko Epson Corporation, Oliff & Berridge, May 23, 2006: US07049686 (7 worldwide citation)


A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12) on a wafer (10); a step of providin ...


10
Yota Shiro, Kubota Yoshihiro, Tsuji Kazuto: Heat dissipation structure of electronic component and semiconductor device. Fujitsu, October 2, 2008: JP2008-235576 (7 worldwide citation)


PROBLEM TO BE SOLVED: To provide a versatile heat dissipation structure of electronic components of improved heat dissipation characteristics, as well as a semiconductor device.SOLUTION: Relating to the heat dissipation structure of an electronic component 35 that is mounted on a wiring substrate 31 ...



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